从零开始学散热 书籍目录-前言-后记

前言

人类正加速进入人工智能与清洁能源时代。电子产品将在这个时代扮演关键角色。虽然半导体工艺的进步使得元器件的能效比不断提高，但人们对产品功能提升的需求还是超越了元器件工艺技术的进步速度，这表现为几乎所有的电子产品的体积功率密度都在逐年升高，也直接导致了原来越严重的热管理问题。

热设计工程师一职在这样的背景下应运而生。这是一个相对新型的职位，截至2020年，我国还没有一所高校设立此专业。在从事实际热设计工作的过程中，我遇到过很多无法获取答案甚至连参考资料都很少的问题。鉴于此，我将我个人的学习和思考总结下来，写就了本书。大体上，这本书系统性地回答了以下问题：

l  为什么电子产品要控制温度？

l  温度控制的基本理论依据是什么？

l  芯片、单板等内部组成如此复杂，我们如何从热设计的角度理解它们？

l  温度控制常用的手段有哪些？

l  散热器、导热界面材料、风扇、液冷板、热管、均温板等为什么会成为当前模块化的热管理部件？如何通过这些模块的设计选型控制产品的温度？

l  热设计工程师如何在控制好产品温度的前提下，同步控制好产品噪音？

l  如何对产品进行热测试验证工作？这些设备的工作原理是怎样的？就验证结果精度而言，各自有什么优缺点？

l  如何使用热仿真软件加速设计进程，甚至实现智能化乃至自动化设计？

l  从理论基础层面，怎么理解热管理方案的智能化及热-力-电-磁的耦合趋势？

l  作为一个相对新兴的职能，如何融入到产品当前成熟的开发流程中去？

这本书最大的特点是所有的阐述都试图从工程实际出发，在通俗易懂和严谨深入层面，我选择了前者，所以这本书里仅保留了几个最基础、形式最简单的公式。我的目的是让基础薄弱的读者也能读懂，让没有工程经验的读者能够快速理解我所想表达的热设计思维，并在实践中设计出温度表现优良的产品。

作者水平有限，书稿虽几经审改，但其中错误与不足之处必不少见，恳请读者不吝赐教。

陈继良Leon Chen

2020-4-13

附书籍目录

目 录

前言·························································································································V
目 录·························································································································I

第一章 电子产品热设计的意义 ·······················································································1
1 温度对电子产品的影响···················································································1
2 温度对芯片的影响机理···················································································2
2.1 热应力和热应变····················································································2
2.2 器件炸裂·····························································································4
2.3 腐蚀···································································································4
2.4 氧化物分解··························································································4
2.5 芯片功耗·····························································································4
2.5 电气性能变化·······················································································6
3 解决芯片热可靠性的两个维度··········································································6
4 热设计方案的评估标准···················································································6
5 本章小结 ·····································································································7
参考文献 ········································································································8

第二章 热设计理论基础 ································································································9
1 热和温度 ·····································································································9
1.1 热动说和热质说····················································································9
1.2 温度的物理意义··················································································10
2 传热学 ······································································································11
2.1 热传导（Thermal Conduction） ·······························································12
2.2 热对流（Thermal Convection） ·······························································15
2.3 热辐射（Thermal Radiation） ·································································16
3 热力学 ······································································································18
3.1 热力学第一定律··················································································19
3.2 热力学第二定律··················································································19
3.3 热力学第三定律··················································································20
3.4 热力学第零定律··················································································20
3.5 理想气体定律·····················································································20
4 流体力学 ···································································································22
4.1 流体的重要性质——粘性······································································22
4.2 流体压强——静压，动压和总压 ····························································23
4.3 表压、真空度和绝对压强······································································25
4.4 流体流动状态——层流和湍流································································25
附加阅读：导热系数的本质··············································································27
5 本章小结 ···································································································28
参考文献 ······································································································29

第三章 热设计研发流程 ······························································································30
1 需求分析(Requirement Analysis) ······································································30
2 概念设计(Concept Design)··············································································32
3 详细设计(Detail Design) ················································································33
4 测试验证(Test and Verification) ·······································································33
5 回归分析(Regression Analysis) ········································································34
6 发布与维护(Launch and Maintenance) ·······························································34
7 本章小结 ···································································································34
参考文献 ······································································································35

第四章 散热方式的选择 ······························································································36
1 散热方式选择的困难性·················································································36
2 自然散热 ···································································································38
3 强迫风冷 ···································································································39
4 间接液冷 ···································································································40
5 直接液冷 ···································································································41
6 本章小结 ···································································································41
参考文献 ······································································································42

第五章 芯片封装和电路板的热特性 ···············································································43
1 IC 芯片封装概述 ··························································································43
2 芯片封装热特性 ··························································································44
2.1 芯片热特性基础··················································································44
2.2 热阻的概念························································································45
2.3 芯片热特性的热阻描述·········································································46
3 芯片封装热阻的影响因素··············································································49
3.1 封装尺寸···························································································49
3.2 封装材料···························································································49
3.3 热源尺寸···························································································50
3.4 单板尺寸和导热系数············································································50
3.5 芯片发热量以及外围气流速度································································51
4 实验测量时结温的反推计算公式·····································································51
5 常见的芯片封装及其热特性···········································································52
5.1 BGA—Ball Grid Array Package 球栅阵列式封装··········································53
5.2 TO——Transistor Outline Package 晶体管外形封装·······································54
5.3 QFP---- Quad Flat Pack 四边扁平封装 ·······················································54
5.4 QFN/DFN ---- (Quad/Dual Flat No-Lead)四边/双边无引脚扁平封装···················55
5.5 封装演变趋势和热设计面临的机遇与挑战 ················································56
6 印制电路板热特性及其在热设计中的关键作用···················································57
6.1 PCB 热传导特点 ··················································································57
6.2 PCB 铜层铺设准则——热设计角度··························································58
6.3 热过孔及其设计注意点·········································································59
7 本章小结 ···································································································61

参考文献 ······································································································62

第六章 散热器的设计 ·································································································64
1 散热器设计需考虑的方面··············································································64
1.1 发热源热流密度··················································································64
1.2 元器件温度要求和工作环境···································································66
1.3 产品内部空间尺寸···············································································66
1.4 散热器安装紧固力···············································································67
1.5 成本考量···························································································67
1.6 外观设计···························································································68
2 几种常见的散热器优化设计思路·····································································68
2.1 热传导——优化散热器扩散热阻 ····························································68
2.2 对流换热——强化对流换热效率 ····························································69
2.3 辐射换热——选择合适的表面处理方式 ···················································70
2.4 总结·································································································71
3 散热器设计注意点汇总·················································································72
4 散热器的生产工艺························································································72
5 本章小结 ···································································································72
参考文献 ······································································································74

第七章 导热界面材料的选型设计 ··················································································75
1 为什么需要导热界面材料··············································································75
2 导热界面材料定义及种类··············································································75
2.1 导热界面材料定义···············································································75
2.2 导热界面材料的种类············································································76
3 导热界面材料的选用关注点···········································································81
3.1 材料自身属性·····················································································81
3.2 应用场景因素·····················································································84
4 导热界面材料的实例运用··············································································85
4.1 导热硅脂的实际运用············································································85
4.2 导热衬垫的实际运用············································································86
4.3 导热填缝剂的实际运用·········································································87
4.4 石墨片的实际运用···············································································87
5 导热界面材料选用的复杂性···········································································88
6 本章小结 ···································································································88
参考文献 ······································································································90

第八章 风扇的选型设计 ······························································································91
1 几何尺寸 ···································································································91
2 确定风量 ···································································································92
3 确定风扇风压·····························································································93
4 平行翅片散热器流阻计算··············································································94
5 风扇的抽风和吹风设计·················································································97
5.1 抽风设计···························································································98
5.2 吹风设计···························································································98
6 风扇转速控制方式·······················································································98
7 风扇噪音考量·····························································································99
8 风扇相似定理····························································································100
9 风扇寿命可靠性 ·························································································100
10 风扇失速区 ·····························································································102
11 风扇选型方法汇总 ····················································································103
12 散热器和风扇的综合设计 ···········································································104
13 本章小结 ································································································106
参考文献 ·····································································································107

第九章 热管和均温板 ································································································108
1 热管和均温板的特点和典型应用····································································108
2 热管和 VC 的基本工作原理 ··········································································110
3 热管或 VC 的性能指标 ················································································111
4 超薄热管和超薄 VC ····················································································113
5 热管和 VC 产品要考虑的细观因素··································································115
6 本章小结 ··································································································115
参考文献 ·····································································································116

第十章 热电冷却器、换热器和机柜空调 ········································································117
1 热电制冷原理····························································································117
2 热电制冷器在电子散热中的优缺点·································································117
3 热电制冷器的选型步骤················································································119
3.1 确定工作电流····················································································120
3.2 确定工作电压····················································································120
3.3 确定 COP 值和选择高效 TEC 的迭代方式 ················································120
3.4 TEC 与系统的匹配 ··············································································121
4 换热器工作原理 ·························································································122
5 换热器的选型····························································································123
5.1 确定需求··························································································123
5.2 计算换热效率····················································································123
6 机柜空调 ··································································································125
7 本章小结 ··································································································127
参考文献 ·····································································································128

第十一章 液冷设计 ···································································································129
1 液冷设计概述····························································································129
1.1 直接液冷··························································································129
1.2 间接液冷··························································································130
2 液冷散热的特点 ·························································································130
3 液冷系统的分类与组成················································································131
3.1 封闭式单循环系统··············································································131
3.2 封闭式双循环系统··············································································132
3.3 开放式系统·······················································································132
3.4. 半开放式系统···················································································132
4 液冷设计各部分注意点················································································133
4.1 液体工质选择····················································································133
4.2 冷板的设计·······················································································135
4.3 冷管和接头·······················································································136
4.4 泵的选择··························································································137
4.5 冷排/换热器的选型设计·······································································140
4.6 其它附件··························································································141
5 冷板散热器的设计步骤和常见加工工艺···························································142
5.1 计算流量··························································································143
5.2 确定冷板材质····················································································143
5.3 流道设计··························································································144
5.4 冷板类型及其优缺点···········································································145
6 本章小结 ··································································································147
参考文献 ·····································································································148

第十二章 热设计中的噪音 ··························································································149
1 热设计与噪音的关系···················································································149
2 声音基础知识概述······················································································149
2.1 声音的本质·······················································································149
2.2 噪声产生原因····················································································149
2.3 声音的几个关键参数···········································································150
3 声音的分析 ·······························································································153
3.1 频程与频谱·······················································································153
3.2 响度与响度级····················································································154
3.3 计权声级··························································································155
4 声音的传播 ·······························································································156
5 电子产品热设计中的噪音·············································································157
5.1 气动噪声··························································································157
5.2 机械噪声··························································································158
5.3 电磁噪声··························································································158
6 噪音测量 ··································································································158
7 噪音控制设计····························································································159
7.1 控制声源··························································································159
7.2 控制传声路径····················································································159
7.3 控制声音接受者·················································································160
8 噪声仿真 ··································································································161
9 本章小结 ··································································································161
参考文献 ·····································································································162

第十三章 风扇调速策略的制定和验证 ···········································································163
1 为什么要对风扇进行调速·············································································163
2 风扇智能调速的条件···················································································163
2.1 风扇转速必须可控··············································································164
2.2 必须有可实时反馈产品散热风险的传感器 ···············································164
2.3 系统中必须内置有效的风扇调速程序 ·····················································165
3 风扇调速策略的设计···················································································167
3.1 温度传感器的布置··············································································167
3.2 风扇调速策略整定步骤········································································167
4 异常情况的风扇转速应对·············································································172
5 本章小结 ··································································································172

第十四章 热测试·······································································································173
1 热测试的目的和内容···················································································173
2 热测试注意事项 ·························································································173
2.1 确保设备的配置和负载与测试工况对应 ··················································173
2.2 确保设备使用的散热物料与设计方案一致 ···············································173
2.3 根据散热方式选择合适的测试环境 ························································174
2.4 关注测试读取结果数据的稳定性 ···························································174
3 温度测试 ··································································································174
3.1 热测试设备·······················································································174
3.2 接触式测温·······················································································175
3.3 非接触式测温····················································································176
4 热测试常用设备仪器···················································································180
5 撰写热测试报告 ·························································································182
6 本章小结 ··································································································184
参考文献 ·····································································································185

第十五章 热仿真软件的功能，原理和使用方法 ·······························································186
1 热仿真的作用····························································································186
2 热仿真的基本原理······················································································186
3 热仿真软件的选择······················································································189
4 热仿真软件的合理使用················································································191
4.1 信息收集··························································································191
4.2 几何建模和属性赋值···········································································192
4.3 网格划分··························································································193
4.4 模型设置··························································································194
4.5 求解计算和后处理··············································································195
5 本章小结 ··································································································196

第十六章 常见电子产品热设计实例 ··············································································197
1 自然散热产品····························································································197
1.1 超薄平板电脑····················································································198
1.2 智能手机··························································································200
1.3 户外通讯设备····················································································204
1.4 LED 灯···························································································207
1.5 盒式自然散热终端··············································································210
2 强迫风冷设计····························································································213
2.1 笔记本电脑·······················································································214
2.2 服务器·····························································································217
3 液冷和风冷的混合冷却················································································222
4 动力电池热管理 ·························································································224
4.1 电池热管理系统的目标········································································226
4.2 电池热学信息确定··············································································226
4.3 电池组热管理方案类型········································································229
4.4 动力电池加热系统··············································································232
4.5 动力电池热管理系统的重量考虑 ···························································234
5 本章小结 ··································································································234
参考文献 ·····································································································235

第十七章 热、电、磁的结合 ·······················································································236
1 一些电磁学概念 ·························································································237
1.1 电容································································································237
1.2 介电常数··························································································238
1.3 介电损耗··························································································239
1.4 磁导率·····························································································240
1.5 磁化机理··························································································242
1.6 磁滞损耗··························································································245
2 信号传输 ··································································································246
2.1 无线电磁波的形成··············································································246
2.2 无线电波的传输·················································································248
3 电磁兼容、电磁屏蔽以及对热设计的影响························································251
3.1 电场屏蔽··························································································251
3.2 磁场屏蔽··························································································252
3.3 电磁屏蔽··························································································254
3.4 电磁兼容··························································································255
4 本章小结 ··································································································256
参考文献 ·····································································································257

后记 ·······················································································································259
致谢 ·······················································································································260
作者简介 ·················································································································261 

从零开始学散热-目录-前言-后记-20200826.pdf