有关建模和热分析的问题

我做了一个对环形电阻热学仿真的图程序如下
/PREP7
!定义单元
ET,1,PLANE55
!*
!*
!定义材料属性, 3.6e7是导热率, 779e12是比热, 3890e-18是密度;如需修改可以在相应位置替换掉,这些数值都是基于微米,千克给出的
MPTEMP,,,,,,,,
MPTEMP,1,0
MPDATA,KXX,1,,3.6e7
MPTEMP,,,,,,,,
MPTEMP,1,0
MPDATA,C,1,,779e12
MPTEMP,,,,,,,,
MPTEMP,1,0
MPDATA,DENS,1,,3890e-18
FLST,2,1,5,ORDE,1
FITEM,2,4
/GO
/PREP7
!建模环形区
BLC4,-455.45,17.95,101.7,-29.9
BLC4,-356.75,20.95,20.95,-224.3
BLC4,-359.75,-200.35,670,29.9
BLC4,301.3,-194.35,-23.95,308
BLC4,298.3,113.65,-484.55,32.85
BLC4,-186.25,149.5,26.9,-218.3
BLC4,-186.25,-68.8,200.4,23.95
BLC4,14.15,-68.8,-20.95,125.6
BLC4,-12.8,56.8,179.5,-26.9
BLC4,163.7,56.8,26.9,-176.4
BLC4,187.6,-116.6,-454.6,-17.95
BLC4,-264.05,-125.6,15,364.8
BLC4,-270,242.2,637.1,-26.9
BLC4,364.1,242.2,23.9,-254.15
BLC4,361.1,0,92.7,-32.9
!将环形区add在一起
FLST,2,15,5,ORDE,2
FITEM,2,1
FITEM,2,-15
AADD,P51X
!对其它区域建模
/PREP7
BLC5,0,0,1530,620
BLC5,-595, ,280,470
BLC5,595, ,280,470
!将所有面overlap一下
FLST,2,4,5,ORDE,3
FITEM,2,1
FITEM,2,-3
FITEM,2,16
AOVLAP,P51X
!画网格
SMRT,6
SMRT,1
MSHAPE,0,2D
MSHKEY,0
!*
FLST,5,5,5,ORDE,2
FITEM,5,3
FITEM,5,-7
CM,_Y,AREA
ASEL, , , ,P51X
CM,_Y1,AREA
CHKMSH,'AREA'
CMSEL,S,_Y
!*
AMESH,_Y1
!*
CMDELE,_Y
CMDELE,_Y1
CMDELE,_Y2
!*
!对电阻条所在的区域（6#面）处施加加热功率357835,这个数是根据你的论文调整出来的,
!你也可以换成其它认为合理的值
!*
FLST,2,1,5,ORDE,1
FITEM,2,6
/GO
!*
BFA,P51X,HGEN,357835
!对边界加300K的温度
FLST,2,4,4,ORDE,3
FITEM,2,1
FITEM,2,-3
FITEM,2,6
!*
/GO
DL,P51X, ,ALL,300,0
!求解
FINISH
/SOL
/STATUS,SOLU
SOLVE
FINISH
/POST1
!*
!看云图
/EFACET,1
PLNSOL, TEMP,, 0
现在我想在这个基础上对上述模型进行 2个相同模型并排 的温度云图每个芯片的工作条件与上面那个相同求各位大神指点啊